PACKAGING MATERIAL FOR ELECTRONIC OVEN

Title:

PACKAGING MATERIAL FOR ELECTRONIC OVEN

Document Type and Number:

Japanese Patent JPH06911

Kind Code:

A

Abstract:

PURPOSE: To provide packaging material for an electronic oven excellent in bending resistance and gas barrier properties as packaging film.

CONSTITUTION: In packaging material having gas barrier properties consisting of plastic base material and thin silicon oxide-based film layer, which is provided at least on one side of the plastic base material, packaging material, which is excellent in gas barrier properties and suitable for heating with an electronic oven can be provided under the condition that the specific gravity of thin film is set to be 1.80-2.20. Further, the packaging material withstands retorting treatment and can be used as the packaging material, which has high flexing resistance and is excellent in utility characteristics as a whole.

Inventors:

MATSUDA NAGANARI
IZEKI SEIJI
MORIHARA YOSHIHARU
KOTANI TORU
OTANI TOSHIYUKI
YAMADA YOZO

Application Number:

JP16121392A

Publication Date:

January 11, 1994

Filing Date:

June 19, 1992

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TOYO BOSEKI

International Classes:

B32B9/00; B32B15/08; B32B27/00; B65D65/42; B65D81/24; B65D81/34; (IPC1-7): B32B9/00; B32B15/08; B32B27/00; B65D65/42; B65D81/24; B65D81/34

Next Patent: MANUFACTURE OF RESIN COMPOSITE TYPE STEEL PLATE