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Patent Searching and Data


Title:
複合材料
Document Type and Number:
Japanese Patent JP7345516
Kind Code:
B2
Abstract:
A composite material 1 according to the present invention includes a solid portion 10 including inorganic particles 20 and a resin 30. The composite material 1 has a porous structure including a plurality of voids 40 surrounded by the solid portion 10. The composite material 1 compressed by 10% has a reaction force of 0.1 kPa to 1000 kPa, and the composite material 1 has a heat conductivity of 0.5 W/(m•K) or more. The heat conductivity is a value measured for one test specimen in a symmetric configuration according to an American Society for Testing and Materials (ASTM) standard (ASTM) D5470-01.

Inventors:
Tetsuya Otsuka
Takanobu Mimura
Tomoya Kato
Application Number:
JP2021058872A
Publication Date:
September 15, 2023
Filing Date:
March 30, 2021
Export Citation:
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Assignee:
NITTO DENKO CORPORATION
International Classes:
C08J9/26
Domestic Patent References:
JP2018109101A
JP2019131760A
JP2019127535A
JP2018512493A
JP2015105282A
JP2016071108A
JP2007320988A
Foreign References:
WO2019131622A1
Attorney, Agent or Firm:
Koichi Kamada
Mitsuhiko Nishio