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Title:
コンポスト化可能なホットメルト接着剤
Document Type and Number:
Japanese Patent JP7394841
Kind Code:
B2
Abstract:
A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.

Inventors:
Kanderski, Monina Dee.
Vitrano, Michael Dee.
Cooler, David Pea.
Busan Paramville, Deepa
Lambert, Jacqueline M.
Morrow, Brian Jay.
Application Number:
JP2021512710A
Publication Date:
December 08, 2023
Filing Date:
September 06, 2019
Export Citation:
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Assignee:
Bostik, Inc.
International Classes:
C09J167/04; B65D81/38; C09J5/06; C09J11/06; C09J167/00
Domestic Patent References:
JP2005002201A
JP9118869A
JP9505615A
JP5339557A
JP52148378A
JP2006044724A
JP2001011425A
JP2001040323A
JP2002088334A
JP2010155951A
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Akiyo Iwahori
Rena Miyoshi
Kamoto Takahashi