Title:
A compound board and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6068626
Kind Code:
B2
Abstract:
A composite substrate 1 according to the present invention comprises: a supporting substrate 10 that is formed of an insulating material; a semiconductor part 20 that is disposed over the supporting substrate 10; and interfacial inclusions 30 that are present at the interface between the supporting substrate 10 and the semiconductor part 20 and contains Ni and Fe so that the ratio of Ni to Fe is 0.4 or more. Consequently, the present invention is able to provide a highly reliable composite substrate wherein the interfacial inclusions 30 are prevented from diffusing into the semiconductor part 20.
Inventors:
Hideki Matsushita
Katsunobu Kitada
Katsunobu Kitada
Application Number:
JP2015514261A
Publication Date:
January 25, 2017
Filing Date:
September 29, 2014
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L21/02; B23K20/00; H01L21/304
Domestic Patent References:
| JP2010287718A | 2010-12-24 | |||
| JP2007324195A | 2007-12-13 | |||
| JP2010287718A | 2010-12-24 | |||
| JPH11103035A | 1999-04-13 |
Foreign References:
| WO2012115269A1 | 2012-08-30 | |||
| WO2013129572A1 | 2013-09-06 | |||
| WO2008029885A1 | 2008-03-13 | |||
| WO2012105473A1 | 2012-08-09 | |||
| WO2012115269A1 | 2012-08-30 | |||
| WO2013129572A1 | 2013-09-06 | |||
| WO2008029885A1 | 2008-03-13 |