複合研削盤および研削方法

Title:

複合研削盤および研削方法

Document Type and Number:

Japanese Patent JP6459524

Kind Code:

B2

More Like This:

WO/2021/094756	A WORKPIECE HOLDING ASSEMBLY FOR A GRINDING MACHINE AND GRINDING METHODS
JP2619497	INDUSTRIAL APPLICABILITY: Grinding apparatus provided with an end face measuring apparatus

Inventors:

Yoritsune Masashi
Yoshiaki Ando
Takeshima Masayuki
Hisashi Kobayashi
Takashi Kondo

Application Number:

JP2015002482A

Publication Date:

January 30, 2019

Filing Date:

January 08, 2015

Export Citation:

Assignee:

JTEKT Corporation

International Classes:

B24B5/12; B24B5/00; B24B41/06

Domestic Patent References:

Foreign References:

DE102011115371B3

Previous Patent: エアバッグ装置

Next Patent: DOCUMENT PREPARATION AND EDITING DEVICE