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Title:
A compound, a high molecular compound, a resist composition, a resist pattern formation method
Document Type and Number:
Japanese Patent JP6243608
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a compound that is useful for improving lithography characteristics, a polymeric compound derived from the compound, a resist composition comprising the polymeric compound, and a method for forming a pattern.SOLUTION: The compound is expressed by general formula (a0-1) below. In the formula, Rrepresents H or an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms; Yand Yrepresent a single bond or a divalent connecting group; Rand Rrepresent a functional group or a group expressed by formula (1-an1), (1-an2) or (1-an3); n1 represents an integer of 0 to 2; n2 represents 0 or 1; Y1 represents a single bond or -SO-; Rrepresents a cyclic group which may have a substituent, a linear alkyl group which may have a substituent, or a linear alkenyl group which may have a substituent; and Xrepresents an organic cation or a metal cation.

Inventors:
Akira Kawakami
Yoshiyuki Utsumi
Application Number:
JP2013020941A
Publication Date:
December 06, 2017
Filing Date:
February 05, 2013
Export Citation:
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Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
C07C309/12; C07C309/19; C07C309/42; C07C309/43; C07C311/09; C07C311/48; C07D307/33; C07D307/93; C07D327/04; C07D493/18; C07D497/18; C09K3/00; G03F7/004; G03F7/039; H01L21/027
Domestic Patent References:
JP2011118335A
JP2011052211A
JP2010032994A
Foreign References:
WO2002068527A1
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida