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Title:
A compound, a thermosetting resin composition, and a thermosetting sheet
Document Type and Number:
Japanese Patent JP6166988
Kind Code:
B2
Inventors:
西尾 健
Application Number:
JP2013182307A
Publication Date:
July 19, 2017
Filing Date:
September 03, 2013
Export Citation:
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Assignee:
デクセリアルズ株式会社
International Classes:
C08G59/70; C07C53/134; C07C53/18; C07C61/135; C07C63/08; C07C381/12; C08K5/36; C08L63/00; C08L71/12
Domestic Patent References:
JP2004269713A
JP2010205498A
JP2002003581A
Foreign References:
Attorney, Agent or Firm:
廣田 浩一
流 良広
松田 奈緒子



 
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