Title:
A conditioning method and a device of a polishing pad
Document Type and Number:
Japanese Patent JP6041967
Kind Code:
B2
Abstract:
A method of and an apparatus for conditioning a surface of a polishing pad 2 is used for conditioning a polishing pad on a polishing table 1 for polishing a thin film formed on a surface of a substrate W . The conditioning method includes bringing a dresser 22 into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is controlled by a controller 40 to be higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.
Inventors:
Mutsumi Tanikawa
Takahiro Shimano
Takahiro Shimano
Application Number:
JP2015234518A
Publication Date:
December 14, 2016
Filing Date:
December 01, 2015
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B37/00; B24B53/02; H01L21/304
Domestic Patent References:
| JP2010076049A | ||||
| JP2002200552A | ||||
| JP2005125444A | ||||
| JP10000550A |
Foreign References:
| US20100081361 | ||||
| US5984764 |
Attorney, Agent or Firm:
Isamu Watanabe
Tetsuya Hirosawa
Tetsuya Hirosawa