Title:
A conductive particulate, anisotropic electric conduction material, and a conductive connection structure
Document Type and Number:
Japanese Patent JP6188527
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive fine particle capable of conductively connecting between electrodes of a package substrate with high connection reliability without using a solder paste, and to provide an anisotropic conductive material and a conductive connection structure obtained by using the conductive fine particles.SOLUTION: There is provided a conductive fine particle having base fine particles 1 and a solder layer 4 formed on the surface of the base fine particle, wherein the conductive fine particle has a particle diameter of 50 to 400 μm and the solder layer has a volume ratio of 0.55 to 0.70.
Inventors:
Hiroya Ishida
Kiyoto Matsushita
Kiyoto Matsushita
Application Number:
JP2013212277A
Publication Date:
August 30, 2017
Filing Date:
October 09, 2013
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01B5/00; H01B1/00; H01B1/22; H01B5/16; H01R11/01; H01R43/00
Domestic Patent References:
| JP2009117333A | ||||
| JP2011094146A | ||||
| JP5408401B1 | ||||
| JP2010253507A |
Foreign References:
| WO2009054502A1 | ||||
| WO2010013668A1 |
Attorney, Agent or Firm:
Atomi International Patent Office
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