Title:
導電性微粒子及び基板構成体
Document Type and Number:
Japanese Patent JP4660065
Kind Code:
B2
Abstract:
This invention provides a conductive fine particle for soldering two or more electrodes of an electric circuit, the conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like. A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3 × 10 -5 to 7 × 10 -5 (1/K).
Inventors:
Hiroshi Kuroda
Nobuyuki Okinaga
Nobuyuki Okinaga
Application Number:
JP2002518473A
Publication Date:
March 30, 2011
Filing Date:
April 27, 2001
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01B5/00; H01R4/00; H01R4/04; H01R11/01; H05K3/34; H01B13/00; H01R4/02; H01R13/03; H05K3/32
Domestic Patent References:
| JPS62188184A | 1987-08-17 | |||
| JPH0536306A | 1993-02-12 | |||
| JPH09185069A | 1997-07-15 | |||
| JP2000133050A | 2000-05-12 | |||
| JPH073230A | 1995-01-06 | |||
| JPH06503180A | 1994-04-07 |
Attorney, Agent or Firm:
Atomi International Patent Office
Yasuo Yasutomi
Yasuo Yasutomi