Title:
A connection structure, a connector, and a manufacturing method of a connection structure
Document Type and Number:
Japanese Patent JP6133228
Kind Code:
B2
Inventors:
Kawamura Kodai
Tonoike Sho
Satoshi Takamura
Tonoike Sho
Satoshi Takamura
Application Number:
JP2014068679A
Publication Date:
May 24, 2017
Filing Date:
March 28, 2014
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
Furukawa as Co., Ltd.
Furukawa as Co., Ltd.
International Classes:
H01R4/18; H01R4/62; H01R13/52
Domestic Patent References:
JP2002216862A | ||||
JP2010045007A |
Attorney, Agent or Firm:
Motoaki Nagata
Eiji Ota
Hiroshi Nishimura
Yoshiaki Nagata
Eiji Ota
Hiroshi Nishimura
Yoshiaki Nagata
Previous Patent: A wiring board and a manufacturing method for the same
Next Patent: FLUIDIZED BED HEATING FURNACE
Next Patent: FLUIDIZED BED HEATING FURNACE