Title:
電力移行用のコネクタカートリッジ積層体
Document Type and Number:
Japanese Patent JP5587864
Kind Code:
B2
Abstract:
Connector assemblies for use with implantable medical devices having easy to assemble contacts are disclosed. The connector assemblies are generally formed by coupling a plurality of ring contacts, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore for receiving a medical lead cable. Contact grooves or spring chambers for positioning the spring contact elements are formed in part by assembling multiple components together. A further aspect is a provision for encasing each connector assembly or stack inside a thermoset layer or a thermoplastic layer before over-molding the same to a sealed housing.
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Inventors:
Fur シッド Dir Maga Neang
Hugh Cook
Hugh Cook
Application Number:
JP2011504200A
Publication Date:
September 10, 2014
Filing Date:
April 10, 2009
Export Citation:
Assignee:
Barh Seal Engineering, Incorporated BAL SEAL ENGINEERING, INC.
International Classes:
A61N1/378; A61N1/36; A61N1/39
Attorney, Agent or Firm:
Axis international patent business corporation