Title:
コネクタ
Document Type and Number:
Japanese Patent JP6690502
Kind Code:
B2
Abstract:
A connector (10) disclosed by this specification includes a primary mold body (20) formed by integrally molding a primary conductor (40) to a primary molding resin (30), and a secondary mold body (50) formed by integrally molding a secondary conductor (70) to a secondary molding resin (60). The secondary conductor (70) includes a main circuit portion (71) extending along the primary mold body (20) and a branched circuit portion (72) branched from the main circuit portion (71) and laterally projecting. The primary molding resin (30) includes a supporting portion (34) laterally projecting from a side surface (61) of the secondary molding resin (60) along the branched circuit portions (72). The supporting portion (34) has a circuit contact surface (35) disposed below a base end part of the branched circuit portion (72) and to be brought into contact with a lower surface of the branched circuit portion (72) and a pair of mold contact surfaces (36) disposed on both left and right sides of the base end part of the branched circuit portion (72) and disposed flush with an upper surface of the branched circuit portion (72).
Inventors:
Yuji Ito
Application Number:
JP2016218642A
Publication Date:
April 28, 2020
Filing Date:
November 09, 2016
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS,LTD.
International Classes:
H01R13/405; H01R25/16; H01R43/24
Domestic Patent References:
| JP2015185420A | ||||
| JP2000252038A | ||||
| JP2005174697A | ||||
| JP2012143019A |
Attorney, Agent or Firm:
Akatsuki Joint Patent Office