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Patent Searching and Data


Title:
A constituent for applied type silicon content film formation, a substrate, and a pattern formation method
Document Type and Number:
Japanese Patent JP6250513
Kind Code:
B2
Abstract:
A composition for forming a coating type silicon-containing film, containing one or more silicic acid skeletal structures represented by the formula (1) and one or more silicon skeletal structures represented by the formula (2), wherein the composition contains a coupling between units shown in the formula (2). There can be provided a composition capable of forming a silicon-containing film that has excellent adhesiveness in fine patterning, and can be easily wet etched by a removing liquid which does not cause damage to a semiconductor substrate and a coating type organic film or a CVD film mainly of carbon which is required in the patterning process.

Inventors:
Seiichiro Tachibana
Yoshinori Taneda
Kikuchi Rie
Tsutomu Ogiwara
Application Number:
JP2014204512A
Publication Date:
December 20, 2017
Filing Date:
October 03, 2014
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09D183/04; C08G77/48; C08G77/56; C08G79/00; C09D7/12; C09D183/05; C09D183/06; C09D183/08; C09D183/14; G03F7/09; G03F7/11; G03F7/16; G03F7/26; H01L21/027
Domestic Patent References:
JP64049037A
JP2008052203A
JP2006023706A
JP2006139083A
JP2009031525A
JP11152338A
JP2004198726A
JP9208704A
JP2013137512A
JP55034258A
JP55034276A
Attorney, Agent or Firm:
Mikio Yoshimiya