A constituent and a method for pattern processing

Japanese Patent JP6233986

B2

Pattern treatment compositions comprise a block copolymer and an organic solvent. The block copolymer comprises a first block and a second block. The first block comprises a unit formed from a first monomer comprising an ethylenically unsaturated polymerizable group and a hydrogen acceptor group, wherein the hydrogen acceptor group is a nitrogen-containing group. The second block comprises a unit formed from a second monomer comprising an ethylenically unsaturated polymerizable group and an aromatic group, provided that the second monomer is not styrene. Wherein: (i) the second block comprises a unit formed from a third monomer comprising an ethylenically unsaturated polymerizable group, and the second monomer and the third monomer are different; and/or (ii) the block copolymer comprises a third block comprising a unit formed from a fourth monomer comprising an ethylenically unsaturated polymerizable group. Also provided are pattern treatment methods using the described compositions. The pattern treatment compositions and methods find particular applicability in the manufacture of semiconductor devices for providing high resolution patterns.

Vipple Jane
Minki Lee
Hua Shin Jou
John Kung Park
Philip Dee Fustad
Jin Wook Sung

JP2016111005A

November 22, 2017

June 02, 2016

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Dow Global Technologies LLC

G03F7/40; H01L21/027

JP2015087749A
JP2016108525A
JP2016006493A
JP2013020211A
JP2011081041A
JP2009147331A
JP2008275995A
JP7503990A

Patent Business Corporation Sender International Patent Office

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