A constituent for organic semiconductor film formation, an organic semiconductor film, a manufacturing method for the same, an organic semiconductor element, and a manufacturing method for the same

Title:

A constituent for organic semiconductor film formation, an organic semiconductor film, a manufacturing method for the same, an organic semiconductor element, and a manufacturing method for the same

Document Type and Number:

Japanese Patent JP6275883

Kind Code:

B2

Abstract:

The purpose of the present invention is to provide: a composition for organic semiconductor film formation, which enables the achievement of an organic semiconductor element that has high mobility, while being suppressed in variation of the mobility; an organic semiconductor film which uses this composition for organic semiconductor film formation; a method for producing this organic semiconductor film; an organic semiconductor element; and a method for manufacturing an organic semiconductor element. A composition for organic semiconductor film formation according to the present invention is characterized by containing: an organic semiconductor that is represented by formula A-1; a polymer; a solvent that has a boiling point of 150°C or more and an SP value of from 18 to 23 (inclusive); and a silicone compound that has a structure represented by formula D-1. CmH2m+1―La1―T―La2―CnH2n+1 (A-1)

Inventors:

Toshihiro Kaya
Satoshi Kitamura

Application Number:

JP2016574756A

Publication Date:

February 07, 2018

Filing Date:

February 03, 2016

Export Citation:

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