Title:
研磨用組成物及びそれを用いた研磨方法
Document Type and Number:
Japanese Patent JP4814502
Kind Code:
B2
Abstract:
A polishing composition includes an abrasive, at least one compound of azoles and derivatives thereof, and water. The polishing composition is used in applications for polishing surfaces of semiconductor substrates in a suitable manner.
Inventors:
Kenji Sakamoto
Application Number:
JP2004262759A
Publication Date:
November 16, 2011
Filing Date:
September 09, 2004
Export Citation:
Assignee:
Fujimi Incorporated Co., Ltd.
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14; H01L21/306
Domestic Patent References:
| JP4313224A | ||||
| JP2002231666A | ||||
| JP2004231748A | ||||
| JP2004031443A | ||||
| JP2002249762A |
Foreign References:
| WO2003094216A1 |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Makoto Onda