Title:
The constituent for polish
Document Type and Number:
Japanese Patent JP6057706
Kind Code:
B2
Abstract:
Provided is a polishing composition which can suppress scratches on the surface of a metal substrate as an object to be polished, while suppressing dishing of the metal substrate. Disclosed is a polishing composition including functional polishing particles and water, the functional polishing particles containing a surface-modifying group having, at one end, a functional group that suppresses dissolution of a metal substrate by adsorbing to the metal substrate, and metal oxide particles to which the surface-modifying group is immobilized.
Inventors:
Masago Onishi
Application Number:
JP2012288415A
Publication Date:
January 11, 2017
Filing Date:
December 28, 2012
Export Citation:
Assignee:
Fujimi Incorporated Co., Ltd.
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| JP2007088499A | ||||
| JP2003520283A |
Foreign References:
| WO2011093153A1 | ||||
| WO2012172983A1 | ||||
| WO2009119178A1 |
Attorney, Agent or Firm:
Hatta International Patent Corporation
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