Title:
チタン含有レジスト下層膜形成用組成物及びパターン形成方法
Document Type and Number:
Japanese Patent JP5830048
Kind Code:
B2
Abstract:
The invention provides a composition for forming a titanium-containing resist underlayer film comprising: as a component (A), compounds selected from titanium compounds represented by the following general formulae (A-1) and (A-2) and a titanium-containing compound obtained by hydrolysis and/or condensation of the titanium compounds, as a component (B), compounds selected from titanium compounds represented by the following general formulae (B-1) and (B-2) and a titanium-containing compound obtained by hydrolysis and/or condensation of the titanium compounds, and as a component (D), solvent. There can be provided a composition for forming a titanium-containing resist underlayer film to form a resist underlayer film having favorable pattern adhesiveness and excellent etching selectivity. Ti(OR1A)4 (A-1) Ti(OR1A)4−na(OR2AO)na (A-2) Ti(OR1B)4 (B-1) Ti(OR1B)4−nb(OR2BO)nb (B-2)
Inventors:
Tsutomu Ogiwara
Seiichiro Tachibana
Takashi Ueda
Yoshinori Taneda
Seiichiro Tachibana
Takashi Ueda
Yoshinori Taneda
Application Number:
JP2013053752A
Publication Date:
December 09, 2015
Filing Date:
March 15, 2013
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
G03F7/11; C08G79/00; H01L21/027
Domestic Patent References:
| JP2009126940A | ||||
| JP2005537502A |
Foreign References:
| WO2013012068A1 |
Attorney, Agent or Firm:
Mikio Yoshimiya
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