Title:
基材の表面を処理する組成物、方法及びデバイス
Document Type and Number:
Japanese Patent JP2018515910
Kind Code:
A
Abstract:
処理組成物、及び処理組成物を用いることにより、基材の表面を処理する方法、及び上に処理組成物を上に有する半導体又はＭＥＭＳ基材。【選択図】図１
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Inventors:
Seiji Inaoka
William Jack Castile, Junior
Raymond Nicholas Bertis
Kathleen Esther Theodoro
Thien Nyu Chen
Mark Richard Brown
William Jack Castile, Junior
Raymond Nicholas Bertis
Kathleen Esther Theodoro
Thien Nyu Chen
Mark Richard Brown
Application Number:
JP2017551102A
Publication Date:
June 14, 2018
Filing Date:
April 01, 2016
Export Citation:
Assignee:
Vertham Materials US, Limited Liability Company
International Classes:
H01L21/304; C07F19/00; C11D7/14; C11D7/16; C11D7/22; C11D7/32; C11D7/36; C11D7/50
Domestic Patent References:
| JP2010192879A | 2010-09-02 | |||
| JP2013118347A | 2013-06-13 |
Foreign References:
| WO2014092424A1 | 2014-06-19 |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Kenji Kimura
Naori Kota
Satomi Hisasa
Shinji Mitsuhashi
Kenji Kimura
Naori Kota
Satomi Hisasa