Title:
接点装置およびその製造方法
Document Type and Number:
Japanese Patent JP4691112
Kind Code:
B2
Abstract:
Provided is a method for producing a contact device, including a step of forming a first conductive film; a step of forming a second conductive film containing a metal or an alloy of the metal on the first conductive film; a step of forming a third conductive film on the second conductive film; and a step of forming a surface layer on the third conductive film, the surface layer containing an oxidative product of the metal in the second conductive film, which metal has been diffused to be precipitated out from the surface of the third conductive film and oxidized.
Inventors:
Yoto Nakamura
Yu Arikawa
Yoshiaki Moro
Sanpei Hirokazu
Yu Arikawa
Yoshiaki Moro
Sanpei Hirokazu
Application Number:
JP2007554990A
Publication Date:
June 01, 2011
Filing Date:
January 19, 2007
Export Citation:
Assignee:
Advantest Corporation
International Classes:
H01H11/04; G01R1/067; H01H1/04; H01H57/00; H01H61/01; H01H49/00
Domestic Patent References:
| JPS61288384A | 1986-12-18 | |||
| JPH04282515A | 1992-10-07 | |||
| JP2003322663A | 2003-11-14 |
Attorney, Agent or Firm:
Akihiro Ryuka