Title:
A contact probe for a power semiconductor inspection
Document Type and Number:
Japanese Patent JP6216994
Kind Code:
B2
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Inventors:
Hideki Fujimoto
Application Number:
JP2015239701A
Publication Date:
October 25, 2017
Filing Date:
November 20, 2015
Export Citation:
Assignee:
Inksu Corporation
International Classes:
G01R31/26; G01R1/067
Domestic Patent References:
| JP2009229259A | ||||
| JP11284127A | ||||
| JP5315414A | ||||
| JP2013088245A | ||||
| JP2011249695A | ||||
| JP2012078174A | ||||
| JP2009128190A | ||||
| JP2014219273A | ||||
| JP2000235048A | ||||
| JP2001291798A |
Foreign References:
| US6236225 | ||||
| US20120229159 |
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