Title:
A cooling channel system and a related method for the high temperature component covered with coating
Document Type and Number:
Japanese Patent JP5993144
Kind Code:
B2
Abstract:
A method for providing a fluid cooling system within a high temperature component is described. At least one microchannel is formed in an external surface of the component; and one or more coolant passage holes are then formed, extending from at least one of the microchannels to an interior region of the component. A layer of a metallic structural coating is then applied over the external surface. At least one slot, or a set of relatively small passive cooling holes, are then formed through the metallic structural coating; extending into at least a portion of the microchannels. A second coating layer is then applied over the first layer. In some embodiments, a sacrificial material is deposited into the microchannels before the first coating layer is applied. Related articles are also described.
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Inventors:
Ronald Scott Bunker
Application Number:
JP2011279319A
Publication Date:
September 14, 2016
Filing Date:
December 21, 2011
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
C23C28/02; B23K26/36; C23C28/00; F01D5/28; F02C7/00; F23R3/42
Domestic Patent References:
| JP2001514090A | ||||
| JP2008200836A | ||||
| JP59155505A |
Foreign References:
| US20070280832 |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka
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