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Patent Searching and Data


Title:
A cooling system and electronic equipment
Document Type and Number:
Japanese Patent JP6217746
Kind Code:
B2
Abstract:
An object of technology disclosed herein is to improve cooling performance for plural heat generating bodies. A cooling system includes a heat dissipating section, plural heat receiving sections, and a bypass section. The heat dissipation section dissipates heat from a coolant by exchanging heat with an external fluid. The plural heat receiving sections are connected in parallel to the heat dissipating section, and heat generated by respective heat generating bodies is absorbed by the coolant. The bypass section couples at least one of the heat receiving sections out of the plurality of heat receiving sections to another heat receiving section.

Inventors:
Teru Nakanishi
Nobuyuki Hayashi
Yasuhiro Yoneda
Application Number:
JP2015506522A
Publication Date:
October 25, 2017
Filing Date:
March 22, 2013
Export Citation:
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Assignee:
富士通株式会社
International Classes:
F28D15/02; H01L23/427; H05K7/20
Domestic Patent References:
JP2006114603A
JP5013063U
JP2012132661A
JP58206347A
JP7022263U
JP8255858A
Foreign References:
WO2011122332A1
WO2012059975A1
WO2011007604A1
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda