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Title:
Copper alloy for plain bearings
Document Type and Number:
Japanese Patent JP6363931
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a technology capable of providing good sinterability uniformly.SOLUTION: The copper alloy for sliding bearing shaft has a composition containing Bi of 1 to 30 mass% and hard particle having average particle diameter of 10 to 50 μm of 0.1 to 10 mass% and the balance Cu with inevitable impurities, where a Bi phase having smaller average particle diameter than that of the hard particle disperses in a Cu matrix and particle containing FeP and FeP are contained in a single particle as the hard particle.SELECTED DRAWING: Figure 2

Inventors:
Yuhei Ebata
Application Number:
JP2014209941A
Publication Date:
July 25, 2018
Filing Date:
October 14, 2014
Export Citation:
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Assignee:
Taiho Kogyo Co., Ltd.
International Classes:
C22C9/00; C22C9/02; C22C9/06; C22C32/00; F16C33/12
Domestic Patent References:
JP2005200703A
JP2005350722A
JP2010535287A
Foreign References:
US20080095658
US20060000527
WO2008018348A1
US20100266444
WO2010030031A1
US20110224112
US20080166578
Attorney, Agent or Firm:
knowledge partners Patent business corporation
Takatoshi Goto