Title:
ELECTROLYTIC COPPER FOIL FOR PRINTED WIRING BOARD AND COPPER-CLAD LAMINATE USING ELECTROLYTIC COPPER FOIL
Document Type and Number:
Japanese Patent JP2016204706
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electrolytic copper foil having high elongation and folding resistance after a heat treatment and less in abnormal projection in a rough surface side and capable of being used suitably for a flexible printed wiring board less in HAZE value when making a copper-clad laminate.SOLUTION: There is provided an electrolytic copper foil for printed wiring board having a glossy surface of an electrolytic copper foil manufactured by continuously deposing onto a drum rotation cathode surface as a contacting surface with an insulation resin substrate, where a specular glossiness with incident angle of 60° in a TD direction of the glossy surface is 220 or less and sum of specular glossiness with incident angle of 60° in the TD direction and a MD direction of the glossy surface is 350 or more.SELECTED DRAWING: Figure 1
Inventors:
SAKON KAORU
AKAMINE HISASHI
AKAMINE HISASHI
Application Number:
JP2015087743A
Publication Date:
December 08, 2016
Filing Date:
April 22, 2015
Export Citation:
Assignee:
FUKUDA METAL FOIL & POWDER CO LTD
International Classes:
C25D1/04; H05K1/09
Domestic Patent References:
| JP2007217791A | 2007-08-30 | |||
| JP2008118163A | 2008-05-22 | |||
| JP2014132106A | 2014-07-17 | |||
| JPH08246183A | 1996-09-24 | |||
| JP2004098659A | 2004-04-02 | |||
| JPH02500374A | 1990-02-08 |
Foreign References:
| US20040163842A1 | 2004-08-26 | |||
| US20100038115A1 | 2010-02-18 | |||
| US20140193660A1 | 2014-07-10 | |||
| US4789438A | 1988-12-06 |
Attorney, Agent or Firm:
Junichi Ando
Uemura Yoshinaga
Makiko Maekawa
Uemura Yoshinaga
Makiko Maekawa
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