Title:
銅張積層板
Document Type and Number:
Japanese Patent JP7273366
Kind Code:
B2
Abstract:
To provide a copper-clad laminate plate capable of controlling an amount of apparent deflection.SOLUTION: A copper-clad laminate plate 1 is configured to comprise a base film 11, a metal layer 12 directly superposed on the base film, and a copper plating layer 20 directly superposed on the metal layer. Further, the copper plating layer is configured to comprise a low sulfur copper plating layer 22 and a high sulfur copper plating layer 21 which is directly superposed on the low sulfur copper plating layer and has a higher sulfur concentration per unit volume than that of the low sulfur copper plating layer. This configuration makes it possible to control warpage of the copper-clad laminate plate in a cross section perpendicular to a length direction of the copper-clad laminate plate. Since the warpage can be controlled, in the copper-clad laminate plate that is transported so that a width direction is horizontal, depth of a shape that becomes valley at a central part of an upper surface in the width direction can be determined, and further the central part of the upper surface in the width direction can be formed in a mountain shape, to enable the amount of the apparent deflection to be controlled.SELECTED DRAWING: Figure 1
Inventors:
Nishiyama Yoshihide
Application Number:
JP2019122888A
Publication Date:
May 15, 2023
Filing Date:
July 01, 2019
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
C25D5/10; B32B15/08; C25D7/06; C25D21/12
Domestic Patent References:
| JP2014082320A | ||||
| JP2009295656A | ||||
| JP2010205799A |
Attorney, Agent or Firm:
Patent Attorney Corporation Yamauchi Patent Office
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