Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COPPER FOIL FOR FLEXIBLE PRINTED CIRCUIT BOARD, AND COPPER CLAD LAMINATE, FLEXIBLE PRINTED CIRCUIT BOARD, AND ELECTRONIC APPARATUS PREPARED THEREWITH
Document Type and Number:
Japanese Patent JP2017141501
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide copper foils for flexible printed circuit boards having excellent bending and etching properties.SOLUTION: Copper foils for flexible printed circuit boards comprise 99.0 mass% or more of Cu with the balance being inevitable impurities, the copper foils having an average crystal grain size of 0.5-4.0 μm and a tensile strength of 235-290 MPa.SELECTED DRAWING: Figure 1

Inventors:
BANDO SHINSUKE
KAN KAZUKI
Application Number:
JP2016063232A
Publication Date:
August 17, 2017
Filing Date:
March 28, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C22C9/00; C22C9/02; C22C9/04; C22C9/06; C22F1/08; H05K1/09
Domestic Patent References:
JP2005068484A2005-03-17
JP2013060651A2013-04-04
JP2009097075A2009-05-07
Attorney, Agent or Firm:
Kenichiro Akao
Akira Shimoda
Kazuhiko Kurihara



 
Previous Patent: A manufacturing method of a vapor deposition mask and a vapor deposition mask

Next Patent: A rolling bar line for cold forge tone Quality goods