Title:
ポリイミドフィルムおよびそれを基材とした銅張積層体
Document Type and Number:
Japanese Patent JP4777471
Kind Code:
B2
Inventors:
Sawasaki Koichi
Masahiro Oguni
Toshihiro Teshiba
Masahiro Oguni
Toshihiro Teshiba
Application Number:
JP2010180128A
Publication Date:
September 21, 2011
Filing Date:
August 11, 2010
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
H05K1/03; B32B15/08; B32B27/34; C08J5/18
Domestic Patent References:
| JP2001072781A | ||||
| JP61264028A | ||||
| JP2003335874A | ||||
| JP5237928A | ||||
| JP5025295A |
Attorney, Agent or Firm:
Ryu Iwatani