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Patent Searching and Data


Title:
A copper compound, materials for thin film formation, and a manufacturing method of a thin film
Document Type and Number:
Japanese Patent JP6278827
Kind Code:
B2
Inventors:
吉野 智晴
遠津 正揮
桜井 淳
西田 章浩
岡部 誠
Application Number:
JP2014100611A
Publication Date:
February 14, 2018
Filing Date:
May 14, 2014
Export Citation:
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Assignee:
株式会社ADEKA
International Classes:
C07C215/08; C07F1/08; C23C16/18; H01L21/28; H01L21/285
Domestic Patent References:
JP2008537947A
Foreign References:
US20130330473
US6822107
Attorney, Agent or Firm:
曾我 道治
梶並 順
大宅 一宏
飯野 智史