A copper foil with a carrier, a method of manufacturing a printed wiring board using the copper foil with a carrier, a method of manufacturing a copper-clad laminate using the copper foil with a carrier, and a method of manufacturing a printed wiring board.

Title:

Document Type and Number:

Japanese Patent JP6360659

Kind Code:

B2

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Inventors:

Tomoki Kobiki
Yuta Nagaura
Kazuhiko Sakaguchi

Application Number:

JP2013077077A

Publication Date:

July 18, 2018

Filing Date:

April 02, 2013

Export Citation:

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Assignee:

JX Nippon Mining & Metals Co., Ltd.

International Classes:

C25D7/06; C25D1/04; H05K1/09; H05K3/38

Domestic Patent References:

JP2007007937A
JP2010006071A
JP2002161394A
JP2000309898A
JP2010242129A
JP2008285751A
JP2012172198A
JP2007146289A
JP2002280689A
JP4036489A
JP2012022939A

Foreign References:

US20130216855
US20120015206

Attorney, Agent or Firm:

Axis International Patent Business Corporation

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