Title:
A copper porous body and a copper porous combined member
Document Type and Number:
Japanese Patent JP6065058
Kind Code:
B2
Abstract:
A porous copper body (10) including a skeleton (13) having a three-dimensional network structure is provided. A porous layer (12) having unevenness is formed on a surface of the skeleton (13), the specific surface area is set to be 0.01 m 2 /g or greater, and the porosity is set to be in a range of 50% to 90%.
Inventors:
Koichi Kita
Jun Kato
Toshihiko Sachi
Jun Kato
Toshihiko Sachi
Application Number:
JP2015119522A
Publication Date:
January 25, 2017
Filing Date:
June 12, 2015
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
B22F3/11; B22F7/04; B22F7/08; C22C1/08
Domestic Patent References:
| JP2000192107A | ||||
| JP200979766A |
Foreign References:
| WO2016063905A1 |
Attorney, Agent or Firm:
Masatake Shiga
Mitsuo Teramoto
Yasushi Matsunuma
Fumihiro Hosokawa
Kazunori Onami
Mitsuo Teramoto
Yasushi Matsunuma
Fumihiro Hosokawa
Kazunori Onami
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