Title:
SOLDERING METHOD
Document Type and Number:
Japanese Patent JPH0592292
Kind Code:
A
Abstract:
PURPOSE: To provide a soldering method which can suppress an air layer from existing between molten solder and a part to be soldered, to suppress an oxide layer from being generated on the surface of the molten solder and reduce the generation of defects of soldering caused by oxide.
CONSTITUTION: The part to be soldered is hearted beyond the melting point of solder, the molten solder is ejected to solder point to be soldered. It is preferable that the atmosphere of the part to be soldered is a non-oxidizing atmosphere having a concentrating of oxygen ≤400ppm for atmosphere of soldering.
Inventors:
MORI AKIRA
ISHII TOSHINORI
MORIKAWA MASAKI
YOSHIDA HIDEAKI
ISHII TOSHINORI
MORIKAWA MASAKI
YOSHIDA HIDEAKI
Application Number:
JP15718191A
Publication Date:
April 16, 1993
Filing Date:
June 27, 1991
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B23K31/02; H01L21/52; B23K101/40; (IPC1-7): B23K31/02; B23K101/40; H01L21/52
Attorney, Agent or Firm:
Masatake Shiga (2 outside)
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