Title:
硬化性化合物
Document Type and Number:
Japanese Patent JP7361029
Kind Code:
B2
Abstract:
Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (Td5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.
More Like This:
Inventors:
Daisuke Ito
Tsukasa Yoshida
Toshihiro Tai
Hitomi Tamaki
Satoshi Kakumoto
Tsukasa Yoshida
Toshihiro Tai
Hitomi Tamaki
Satoshi Kakumoto
Application Number:
JP2020525556A
Publication Date:
October 13, 2023
Filing Date:
June 10, 2019
Export Citation:
Assignee:
Daicel Corporation
International Classes:
C07D207/452; B32B7/027; B32B27/34; C07D209/48; C09D149/00; C09D179/04; C09D201/00; C09J149/00; C09J179/04; C09J201/00; C09K3/10
Domestic Patent References:
| JP2000219741A | ||||
| JP59093724A |
Foreign References:
| WO2018107453A1 | ||||
| WO2018107929A1 |
Other References:
Polymer,1992年,33,5094-5097
Polymer,1989年,30,978-985
Materials Research Society Symposium Proceedings,1991年,189,421-430
Materials Research Society Symposium Proceedings,1988年,124,181-188
International SAMPE Symposium and Exhibition,1989年,34,139-149
Polymer Preprints,1990年,31,444-445
Polymer Preprints,1988年,29,346-348
Polyimides: Mater. Chem. Charact.,1989年,213-227
Polymeric Materials Science and Engineering,1989年,60,438-442
Polymer,1989年,30,978-985
Materials Research Society Symposium Proceedings,1991年,189,421-430
Materials Research Society Symposium Proceedings,1988年,124,181-188
International SAMPE Symposium and Exhibition,1989年,34,139-149
Polymer Preprints,1990年,31,444-445
Polymer Preprints,1988年,29,346-348
Polyimides: Mater. Chem. Charact.,1989年,213-227
Polymeric Materials Science and Engineering,1989年,60,438-442
Attorney, Agent or Firm:
Patent Attorney Corporation G-chemical