Title:
硬化性ポリイミド
Document Type and Number:
Japanese Patent JP7383487
Kind Code:
B2
Abstract:
The present invention provides curable, high molecular weight (>20,000 Daltons) polyimide compounds. The polyimides, once cured, possess a wide range of glass transition temperatures, have high tensile strength and high elongation. Furthermore, the cured polyimides are hydrophobic, have high glass transition temperatures, low coefficient of thermal expansion, very low dielectric constant and very low dielectric dissipation factor.
Inventors:
Mesoori Farhad Ji
Application Number:
JP2019570493A
Publication Date:
November 20, 2023
Filing Date:
June 25, 2018
Export Citation:
Assignee:
Designer Molecules Inc.
International Classes:
C08G73/10; C08J5/04; C09D179/08; C09J179/08; H05K1/03
Domestic Patent References:
| JP2004333672A | ||||
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| JP2003131371A | ||||
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| JP5086183A | ||||
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Attorney, Agent or Firm:
Kazunori Tsushinaga