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Title:
CUTTING DEVICE AND CUTTING METHOD OF MATERIAL
Document Type and Number:
Japanese Patent JP2016112618
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting device and a cutting method that cut material accurately in a short time.SOLUTION: A cutting device of the present invention comprises: a device frame; cutting means equipped in the device frame, and cutting a tip crop, a rear end crop and both sides of material by mechanical type cutting using a circular saw; and transfer means equipped in the device frame, and transferring the material to respective cutting processes in the cutting means. The cutting means includes: a crop cutting part moving in the width direction of the material, and cutting the tip crop or the rear end crop of the material; and a side cutting part disposed at both sides in the width direction of the material while being separated to each other, and cutting both sides of the material passing while being transferred. The crop cutting part is characterized as follows: one part is provided, and cuts the tip and rear end crop of the material by the transfer of the material sequentially or in an inverse order; or two units are sequentially provided, and one part cuts the tip crop of the material and the other cuts the rear end crop of the material.SELECTED DRAWING: Figure 5

Inventors:
MOON CHANG HO
PARK SUNG HO
NAM HYUN-WOONG
LEE SUNG JIN
KIM WON SOO
KIM CHINKO
CHOI KANG HYOUK
Application Number:
JP2015240758A
Publication Date:
June 23, 2016
Filing Date:
December 10, 2015
Export Citation:
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Assignee:
POSCO
International Classes:
B21B15/00; B21B39/14; B23D45/10; B23D47/00; B23D47/04
Domestic Patent References:
JP2010167438A2010-08-05
JPS5831913U1983-03-02
JP2003266108A2003-09-24
JPS5161331U1976-05-14
Attorney, Agent or Firm:
Kyosei International Patent Office