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Patent Searching and Data


Title:
Cutting device and cutting method
Document Type and Number:
Japanese Patent JP6368422
Kind Code:
B2
Abstract:
The present invention provides a cutting apparatus comprising: a supply part for supplying an object to be cut; a first cutting part for cutting the object to be cut, provided from the supply part; a carrying part arranged to be consecutive to the first cutting part to carry an intermediate cut object, cut by the first cutting part; and a second cutting part arranged to be consecutive to the carrying part to receive and cut the intermediate cut object from the carrying part, wherein the first and second cutting parts comprise saw blade parts movably and rotatably configured to cut the object to be cut or the intermediate cut object, and the saw blade part has a rotary shaft formed on the upper side of the object to be cut or the intermediate cut object.

Inventors:
Moon, Chang-ho
Hyun-eun, Nam
Choi, Kang-Hyuk
Kim, Byung-jin
Lee, Mi-hyun
Kim, Hong-Gi
Lee Sung-Jin
Chun, Myung-Sik
Application Number:
JP2017502178A
Publication Date:
August 01, 2018
Filing Date:
July 17, 2015
Export Citation:
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Assignee:
POSCO
International Classes:
B23D47/04; B22D11/126; B23D45/02; B23D47/02
Domestic Patent References:
JP62057815A
JP2011177847A
JP59183726U
JP60141426A
Foreign References:
KR1020100120848A
EP1990115A1
KR200424634Y1
Attorney, Agent or Firm:
Kyosei International Patent Office