Title:
カッティング装置
Document Type and Number:
Japanese Patent JP7249632
Kind Code:
B2
Abstract:
To provide a cutting device that can stably cut off a material into a shape as intended, and further can secure cutting accuracy even when cutting the material at high speed.SOLUTION: A cutting device according to the present invention comprises: lifting means 5 that lifts up and down cutting means S relatively to a material W held by material holding means 2; moving means that moves forward the cutting means S relatively to the material W; and control means that outputs commands to the lifting means 5 and the moving means 4 and drives both means. When cutting off the material W, the control means moves the cutting means S along a predetermined cut line L in one direction from a first point P2 to a second point P3 while dropping the cutting means S down to a predetermined depth position, then stops driving of the lifting means 5, at the second point P3, and outputs a command to move the cutting means S in the opposite direction from the second point P3 to the first point P2 while maintaining a relative depth of the cutting means S to the material W.SELECTED DRAWING: Figure 5
Inventors:
Atsushi Tanaka
Application Number:
JP2019107670A
Publication Date:
March 31, 2023
Filing Date:
June 10, 2019
Export Citation:
Assignee:
acs corporation
International Classes:
B26D5/00; B26D7/08; G05B19/4103
Domestic Patent References:
| JP2016159408A | ||||
| JP2017080854A | ||||
| JP2017047521A |
Attorney, Agent or Firm:
Yoshihiro Uemura
Hiroko Negishi
Hiroko Negishi
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