Title:
切断装置
Document Type and Number:
Japanese Patent JP7314688
Kind Code:
B2
Abstract:
A cutting device decides a cutting pressure correspondence value corresponding to a pressure applied to a mounting portion of a cutting blade when cutting an object to be cut using the cutting blade based on a first pressure correspondence value corresponding to the pressure applied to the mounting portion when it is detected that the cutting blade has come into contact with the object to be cut in the course of the mounting portion, and on a second pressure correspondence value corresponding to the pressure applied to the mounting portion when it is detected that the cutting blade has reached a holding surface of the holding member of the object to be cut. A cutting device applies the pressure to the mounting portion based on the cutting pressure correspondence value and cuts the object to be cut using the cutting blade mounted to the mounting portion.
Inventors:
Kentaro Sugiyama
Yasuhito Shikama
Yasuhito Shikama
Application Number:
JP2019138263A
Publication Date:
July 26, 2023
Filing Date:
July 26, 2019
Export Citation:
Assignee:
Brother Industries, Ltd.
International Classes:
B26D5/00; B65H35/08
Domestic Patent References:
| JP2017109251A | ||||
| JP2018171669A | ||||
| JP2007136612A | ||||
| JP5104497A | ||||
| JP2005246562A | ||||
| JP50053980A |
Foreign References:
| WO2019188117A1 |
Attorney, Agent or Firm:
Hisashi Yamamoto
Tomohiro Inayama
Tomohiro Inayama