Title:
切削装置
Document Type and Number:
Japanese Patent JP7408306
Kind Code:
B2
Abstract:
To enable suppression of generation of a defective wafer.SOLUTION: A cutting device comprises: a chuck table; a cutting unit; a transfer unit that performs carrying or export of a wafer into the chuck table by sucking and holding a front surface side of the wafer; an inspection unit that inspects a state of a holding surface of the chuck table or a back surface side of the wafer held by the transfer unit; a notification part that notifies notification information to an operator; and a control unit that controls each construction element. The inspection unit includes: a photographing unit that photographs the holding surface or the back surface side of the wafer held by the transfer unit; and a determination part that compares a reference image of the holding surface which is previously registered or the back surface of the wafer with an image obtained by photographing with the photographing unit, and determines occurrence of abnormality from the presence/absence of difference by a threshold value or more. The determination part causes the notification part to notify the occurrence of abnormality when the determination part of the inspection unit determines the occurrence of abnormality.SELECTED DRAWING: Figure 1
Inventors:
Naoko Yamamoto
Application Number:
JP2019118775A
Publication Date:
January 05, 2024
Filing Date:
June 26, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B24B27/06; B24B49/12; B24B55/06
Domestic Patent References:
| JP2000216227A | ||||
| JP2000021820A | ||||
| JP2008064595A | ||||
| JP2016039286A | ||||
| JP2016055365A | ||||
| JP2016095244A | ||||
| JP2011165932A | ||||
| JP2018114563A |
Attorney, Agent or Firm:
Sakai International Patent Office