Title:
セラミック製品の切断システムおよび方法
Document Type and Number:
Japanese Patent JP5830125
Kind Code:
B2
Abstract:
Cutting and grinding of ceramic-type logs to a desired piece length is disclosed. A method of manufacturing ceramic ware is disclosed which comprises transversely cutting a piece from a ceramic-type log having a longitudinal axis by cutting into the log with a blade at a location along the length of the log to form a cut transverse surface on the piece and grinding the cut transverse surface with a side of the blade. An apparatus for manufacturing ceramic ware is also disclosed comprising means for transversely cutting a piece from a ceramic-type log having a longitudinal axis, including a blade for cutting into the log at a location along the length of the log to form a cut transverse surface on the piece, and means for grinding the cut transverse surface with a side of the blade.
Inventors:
Ronald A Boyo
George Peasanski
George Peasanski
Application Number:
JP2014071828A
Publication Date:
December 09, 2015
Filing Date:
March 31, 2014
Export Citation:
Assignee:
CORNING INCORPORATED
International Classes:
B28B11/14; B26D1/14; B26D3/00
Domestic Patent References:
| JP2007320312A | ||||
| JP11090886A | ||||
| JP2000155236A | ||||
| JP61168494A | ||||
| JP55002530U | ||||
| JP2003220605A | ||||
| JP7251321A |
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma
Go Sakuma