Title:
PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP3209121
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a miniaturizable pressure sensor.
SOLUTION: MID(molded interconnection device) molding substrate technology is used to form a package main body 1 with a recessed part 1a and pressure inlet 1b formed in the bottom surface of the recessed part 1a. An electrode 1d is formed from the upper surface of the side wall of the recessed part 1a to the side of the outer periphery of the package main body 1 and the back surface of the package main body 1. Next to this, a sensor chip 3 is joined to the bottom surface of the recessed part 1a via a glass base 4, and wire bonding is performed to an electrode 3b and the electrode 1d by a wire 5. And then a silicon resin 6 is applied to the surface of the sensor chip 3. Further, a lid body 7 in the form of a box with a barrier wall 7a at the end of outer periphery is formed, and the lower surface of the barrier wall 7a in the lid body 7 is joined to the upper surface of the side wall of the recessed part 1a to complete the manufacturing of a pressure sensor.
Inventors:
Sadayuki Kaku
Shigenari Takami
Shigenari Takami
Application Number:
JP28969596A
Publication Date:
September 17, 2001
Filing Date:
October 31, 1996
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
G01P15/125; G01L9/00; G01L9/04; G01L9/12; H01L29/84; (IPC1-7): G01L9/04; H01L29/84
Domestic Patent References:
| JP5997030A | ||||
| JP5149815A | ||||
| JP7174654A | ||||
| JP7234244A | ||||
| JP621482A | ||||
| JP255145U |
Attorney, Agent or Firm:
Junji Ando (1 person outside)