Title:
マイクロメカニカル流体制御コンポーネントを取り付ける装置および方法
Document Type and Number:
Japanese Patent JP4734814
Kind Code:
B2
Abstract:
An apparatus for mounting micromechanical fluid control components includes a manifold interface plate adaptable for connection to a manifold substrate oriented in a horizontal plane. The manifold interface plate receives mounting stress forces from the manifold substrate along the horizontal plane. An orthogonal component plate is connected to the manifold interface plate in a vertical plane with respect to the horizontal plane of the manifold substrate. The orthogonal component plate includes an orthogonal mounting surface with a micromechanical fluid control component mounted on it. The position of the micromechanical fluid control component on the orthogonal mounting surface substantially isolates the micromechanical fluid control component from the mounting stress forces.
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Inventors:
Selzer Michael Jay
Archic Errol Bee
Taheili Bayback A
Archic Errol Bee
Taheili Bayback A
Application Number:
JP2001509898A
Publication Date:
July 27, 2011
Filing Date:
July 10, 2000
Export Citation:
Assignee:
SMC Corporation
International Classes:
B81B1/00; B81C3/00; F15B11/00; F15C5/00; F16K27/00; F16K99/00
Foreign References:
| WO2000031422A1 |
Attorney, Agent or Firm:
Takehiro Chiba