Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
A device and a method for cutting the structure containing a wire-like nanoscale object
Document Type and Number:
Japanese Patent JP6096122
Kind Code:
B2
Abstract:
A device for cutting a structure including nanotubes, including: a mechanism to polarize linearly laser pulses emitted in a direction of the structure, wherein a duration of the laser pulses is roughly between 1 femtosecond and 300 femtoseconds; and a mechanism to focus the linearly polarized laser pulses on the structure.

Inventors:
Pascal Blanche
Olivier Cheburmontier
Olivier Gobert
Application Number:
JP2013543731A
Publication Date:
March 15, 2017
Filing Date:
December 14, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
INSERM(INSTITUT NATIONAL DE LA SANTE ET DE LA RECHERCHE MEDICALE)
International Classes:
B23K26/12; B23K26/00; B23K26/142; B23K26/38; B23K26/40; B82Y40/00
Foreign References:
US20080033135
WO2007012215A1
WO2007149109A1
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro