Title:
廃電気電子機器のリサイクル中にはんだ金属を剥離するための装置及び方法
Document Type and Number:
Japanese Patent JP6397946
Kind Code:
B2
Abstract:
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
Inventors:
Chen, Chang Nu
Kolsensky, Michael Bee.
Gian Pin
Kolsensky, Michael Bee.
Gian Pin
Application Number:
JP2017036050A
Publication Date:
September 26, 2018
Filing Date:
February 28, 2017
Export Citation:
Assignee:
Entegris Incorporated
International Classes:
C22B7/00; C22B3/04; C22B11/00
Domestic Patent References:
| JP2007190551A | ||||
| JP2001148566A | ||||
| JP7336042A | ||||
| JP10314713A |
Foreign References:
| WO2011130622A1 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation