Title:
貼付ラベルを形成及びカットするための装置及び方法
Document Type and Number:
Japanese Patent JP5607366
Kind Code:
B2
Abstract:
A method and apparatus enables linered label applicators to use labels on thin liners. Linered labels comprise a composite of an elongate sheet of thin or light-weight temporary liner having a precut label adhered to a low adhesion surface. The cut-out labels on the liner are fed into the linered label applicator. The use of support mechanisms other then vacuum application on rollers enables the use of thinner liner sheets on labels. A die head for cutting or perforating labels comprising adhesive on label stock comprising a die head having at least 80% of its outer surface comprising flat areas between cutting edges, multiple cutting edges on the outer surface, and an internal volume in the die head, the internal volume for carrying coolant liquid into and out of the volume so as to cool the outer surface of the die head when the coolant temperature is at least 10° C. cooler than the outer surface of the die head.
Inventors:
フィリプス, Robert
Application Number:
JP2009540278A
Publication Date:
October 15, 2014
Filing Date:
December 05, 2007
Export Citation:
Assignee:
Avery Dennison Condominium ration Avery Dennison Corporation
International Classes:
B31D1/02; B26F1/10; B65C9/18
Attorney, Agent or Firm:
Patent business corporation Hiroe associates patent firm