Title:
固体基板上に能動素子を実装する装置および方法
Document Type and Number:
Japanese Patent JP2014507092
Kind Code:
A
Abstract:
In an arrangement for transmitting power or data through a solid rigid substrate without penetrating the substrate, acoustic transducer components are mounted on the substrate by means of strain isolator elements which are welded or otherwise bonded to the substrate and providing an attachment surface to which the attachment interface of the acoustic transducer may be attached. The strain isolator element is of the same or similar acoustic impedance as the rigid substrate and may indeed be formed of the same material. Various geometries of strain isolator are disclosed, including a plain spacer block, and one comprising a stalk attached to the solid rigid substrate and topped by a disc in a ‘mushroom’ configuration.
Inventors:
Bagshaw, John Martin
Archer, Nicholas John
Kent, Lionel William John
Lowe, Duncan Peter
Archer, Nicholas John
Kent, Lionel William John
Lowe, Duncan Peter
Application Number:
JP2013550948A
Publication Date:
March 20, 2014
Filing Date:
January 24, 2012
Export Citation:
Assignee:
BAE SYSTEMS plc
International Classes:
H04B11/00; H04R1/00
Domestic Patent References:
| JPS4727488A | ||||
| JP2009302707A | 2009-12-24 | |||
| JPH07297560A | 1995-11-10 | |||
| JP2001156413A | 2001-06-08 | |||
| JP2009519691A | 2009-05-14 | |||
| JP2002271273A | 2002-09-20 |
Attorney, Agent or Firm:
Kurata Masatoshi
Yoshihiro Fukuhara
Makoto Nakamura
Nobuhisa Nogawa
Takashi Mine
Katsu Sunagawa
Yoshihiro Fukuhara
Makoto Nakamura
Nobuhisa Nogawa
Takashi Mine
Katsu Sunagawa