Title:
A device provided with a plurality of passive components which can be set from a plurality of beer which can be set to a lamination integrated circuit package, lamination Die Package , computing devices, and those manufacturing methods
Document Type and Number:
Japanese Patent JP6214617
Kind Code:
B2
Abstract:
Integrated passive components in a stacked integrated circuit package are described. In one embodiment an apparatus has a substrate, a first die coupled to the substrate over the substrate, the first die including a power supply circuit coupled to the substrate to receive power, a second die having a processing core and coupled to the first die over the first die, the first die being coupled to the power supply circuit to power the processing core, a via through the first die, and a passive device formed in the via of the first die and coupled to the power supply circuit.
Inventors:
Sharan, Sugit
Mahayan, Ravindranas
Ruth, Stefan
Gardner, Donald
Mahayan, Ravindranas
Ruth, Stefan
Gardner, Donald
Application Number:
JP2015223148A
Publication Date:
October 18, 2017
Filing Date:
November 13, 2015
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
H01L25/065; H01L21/822; H01L25/00; H01L25/07; H01L25/18; H01L27/04
Domestic Patent References:
| JP2006019455A |
Foreign References:
| US20140092574 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation
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