Devices that can be manufactured at the wafer level and their manufacturing methods

Title:

Devices that can be manufactured at the wafer level and their manufacturing methods

Document Type and Number:

Japanese Patent JP6365853

Kind Code:

B2

Abstract:

A component which can be produced at wafer level has a first chip and a second chip connected thereto. The connection is (at least partially) established via a first and a second connecting structure and a first and a second contact structure of the second chip. An adaptation structure between the first chip and the first connecting structure equalizes a height difference between the first and the second contact structure.

Inventors:

Pearl, Wolfgang

Application Number:

JP2016510971A

Publication Date:

August 01, 2018

Filing Date:

March 21, 2014

Export Citation:

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