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Title:
A dice device and a manufacturing method of a self-support type fiber optic cable
Document Type and Number:
Japanese Patent JP5908391
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a die device which can suppress resin pressure variation between neck part formation and slit formation while suppressing the waste amount of resin when providing slits intermittently in a length direction of a neck part, and also can suppress variation in shape and size of a cable.SOLUTION: A die device includes: a mouthpiece 40 provided successively with a main body part passage 42 forming a cable main body part, a neck part passage 43 forming a neck part, and a support wire part passage 41 forming a support wire; and a shutter 50 which can move in a direction orthogonal to the direction of succession of the main body part passage 42, neck part passage 43, and support wire part passage 41, and has a part with a first width SW1 and a part with a second width SW2 narrower than the first width SW1 in the direction of succession, a part of the neck part passage 43 being shielded with the part with the first width SW1 not to part the neck part passage 43 during neck part formation and the other part of the neck part passage 43 being shielded with the part with the second width SW2 to part the neck part passage 43.

Inventors:
Daiki Takeda
Naoki Okada
Masayoshi Yamanaka
Application Number:
JP2012264933A
Publication Date:
April 26, 2016
Filing Date:
December 04, 2012
Export Citation:
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Assignee:
Fujikura Ltd.
International Classes:
G02B6/44
Domestic Patent References:
JP2002063818A
JP2000081555A
JP8273459A
JP8306252A
Foreign References:
GB2262381A
Attorney, Agent or Firm:
Takaaki Yamazaki



 
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